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RESEARCH PAPERS

A Numerical Lead Frame Compliance and Stress Model

[+] Author and Article Information
Lewis S. Goldmann

IBM, East Fishkill, NY 12533

J. Electron. Packag 116(1), 23-29 (Mar 01, 1994) (7 pages) doi:10.1115/1.2905489 History: Received June 19, 1993; Revised January 12, 1994; Online April 28, 2008

Abstract

A new method is presented to compute the mechanical compliance and thermal stress in surface mount leads of arbitrary shape. It involves expressing the profile polynomially by a computer-generated spline curve, and numerically integrating the generalized Castigliano formulas. Comparisons to data in the literature, generated by standard analytical and experimental techniques, show excellent agreement. An example is presented to show typical results obtainable by using the model.

Copyright © 1994 by The American Society of Mechanical Engineers
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