An Efficient Numerical Technique for Thermal Characterization of Printed Wiring Boards

[+] Author and Article Information
G. G. Stefani

Department of Mechanical & Industrial Engineering, State University of New York, Binghamton, NY 13902-6000

N. S. Goel, D. B. Jenks

Department of Systems Science, State University of New York, Binghamton, NY 13902-6000

J. Electron. Packag 115(4), 366-372 (Dec 01, 1993) (7 pages) doi:10.1115/1.2909345 History: Received May 06, 1992; Revised July 26, 1993; Online April 28, 2008


Thermal modeling of Surface Mount Technology (SMT) microelectronics packages is difficult due to the complexity of the printed wiring board (PWB) plates through hole (PTH) structure. A simple, yet powerful finite difference based approach, called EPIC (Equivalent Parameter for Interfacial Cells), for modelling complex 2-D and 3-D geometries with multiple materials is used to model the PTH structure. A technique for computing an effective thermal conductivity for the PWB is presented. The results compare favorably with those from a commercially available finite element package but require far less computer time.

Copyright © 1993 by The American Society of Mechanical Engineers
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