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RESEARCH PAPERS

An Efficient Numerical Technique for Thermal Characterization of Printed Wiring Boards

[+] Author and Article Information
G. G. Stefani

Department of Mechanical & Industrial Engineering, State University of New York, Binghamton, NY 13902-6000

N. S. Goel, D. B. Jenks

Department of Systems Science, State University of New York, Binghamton, NY 13902-6000

J. Electron. Packag 115(4), 366-372 (Dec 01, 1993) (7 pages) doi:10.1115/1.2909345 History: Received May 06, 1992; Revised July 26, 1993; Online April 28, 2008

Abstract

Thermal modeling of Surface Mount Technology (SMT) microelectronics packages is difficult due to the complexity of the printed wiring board (PWB) plates through hole (PTH) structure. A simple, yet powerful finite difference based approach, called EPIC (Equivalent Parameter for Interfacial Cells), for modelling complex 2-D and 3-D geometries with multiple materials is used to model the PTH structure. A technique for computing an effective thermal conductivity for the PWB is presented. The results compare favorably with those from a commercially available finite element package but require far less computer time.

Copyright © 1993 by The American Society of Mechanical Engineers
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