A Simplified Thermal Analysis and Design Methodology for Printed Circuit Boards

[+] Author and Article Information
A. Hadim

Department of Mechanical Engineering, Stevens Institute of Technology, Hoboken, NJ 07030

J. Electron. Packag 115(3), 339-342 (Sep 01, 1993) (4 pages) doi:10.1115/1.2909338 History: Received August 21, 1992; Revised April 10, 1993; Online April 28, 2008


A simplified methodology is developed for thermal analysis and design of printed circuit boards. It combines the use of computer-aided thermal network modeling and a simplified experimental technique. In order to demonstrate its capabilities, this methodology is implemented to correlate natural convection on a printed circuit board oriented horizontally inside an enclosure. The empirical constants used in the correlation were determined through a numerical algorithm in which the sum of the squared error between calculated temperatures and experimental measurements is minimized using the downhill simplex algorithm.

Copyright © 1993 by The American Society of Mechanical Engineers
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