0
RESEARCH PAPERS

Thermal Fatigue of Low-Temperature Solder Alloys in Insertion Mount Assembly

[+] Author and Article Information
J. Seyyedi

Digital Equipment Corporation, Maynard, MA 01754-2571

J. Electron. Packag 115(3), 305-311 (Sep 01, 1993) (7 pages) doi:10.1115/1.2909333 History: Received November 20, 1992; Revised April 13, 1993; Online April 28, 2008

Abstract

Thermal fatigue resistance was investigated for insertion mount solder joints, manufactured with 58Bi-42Sn (wt. %), 43Sn-43Pb-14Bi, 52In-48Sn and 40In-40Sn-20Pb low-temperature alloys. Accelerated thermal cycling was used in conjunction with metallographic analysis to determine the fatigue resistance and to elucidate the failure mode for each solder composition. Additionally, the behavior of each solder alloy was compared to that of 63Sn-37Pb solder, tested under identical conditions. A two-phase microstructure with lamellar morphology was observed in 58Bi-42Sn, whereas a globular morphology was prevalent in the remaining alloys. The Bi-containing solders demonstrate fatigue resistance comparable to 63Sn-37Pb, but greater than the In-bearing alloys. These differences and microstructure changes prior to and during thermal fatigue testing are discussed.

Copyright © 1993 by The American Society of Mechanical Engineers
Your Session has timed out. Please sign back in to continue.

References

Figures

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In