Application of Stochastic Finite Element Method to Thermal Analysis for Computer Cooling

[+] Author and Article Information
Shigekazu Kieda, Noriyuki Ashiwake

Mechanical Engineering Research Laboratory, Hitachi, Ltd., 502 Kandatsu, Tsuchiura, Ibaraki, 315 Japan

Takahiro Daikoku, Shizuo Zushi

General Purpose Computer Division, Hitachi, Ltd., 1 Horiyamashita, Hadano, Kanagawa, 259-13 Japan

J. Electron. Packag 115(3), 270-275 (Sep 01, 1993) (6 pages) doi:10.1115/1.2909328 History: Revised June 10, 1993; Online April 28, 2008


A stochastic finite element method is applied to thermal analysis of cooling in large-scale computers using a multi-fin flexible thermal contactor. The stochastic finite element method is a general technique to incorporate the effect of stochastic or statistical features of parameters into a finite element method by means of sensitivity analysis. Using this method, the temperature distribution of the chip is calculated, and also temperature variations associated with variations of thermal properties, heat generation rates, and uncertainties involved in real systems are estimated. Following presentation of the results obtained, the thermal performance of this system and applicability of the stochastic finite element method to computer cooling problems are discussed.

Copyright © 1993 by The American Society of Mechanical Engineers
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