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RESEARCH PAPERS

Solder Joint Reliability of Surface Mount Connectors

[+] Author and Article Information
J. Lau, T. Marcotte, J. Severine, A. Lee, S. Erasmus, T. Baker, J. Moldaschel, M. Sporer, G. Burward-Hoy

Hewlett-Packard Company, Palo Alto, CA 94304

J. Electron. Packag 115(2), 180-188 (Jun 01, 1993) (9 pages) doi:10.1115/1.2909315 History: Received April 12, 1993; Online April 28, 2008

Abstract

The solder joint reliability of five different surface mount connectors has been studied by eleven different experimental methods. A set of test methods and specifications for determining the reliability of the solder joints of surface mount connectors has been recommended.

Copyright © 1993 by The American Society of Mechanical Engineers
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