A Detailed Thermal Model of the Infrared Reflow Soldering Process

[+] Author and Article Information
M. A. Eftychiou, T. L. Bergman, G. Y. Masada

Department of Mechanical Engineering, The University of Texas at Austin, Austin, TX 78712

J. Electron. Packag 115(1), 55-62 (Mar 01, 1993) (8 pages) doi:10.1115/1.2909302 History: Received April 07, 1992; Revised November 30, 1992; Online April 28, 2008


A thermal model of the infrared reflow soldering process is developed and sample predictions are reported. The model, which accounts for coupled radiation, mixed convection and conduction heat transfer, is capable of predicting relevant thermal effects ranging from the convection characteristics within the IR oven to the detailed thermal response, including solid-liquid phase change, of individual solder connections. Although the heat transfer here is radiatively dominated, mixed convection and conduction effects are important in determining the thermal response of the card assembly.

Copyright © 1993 by The American Society of Mechanical Engineers
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