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RESEARCH PAPERS

Torsion of Elastically Coupled Plates With Applications to Electronic Packaging

[+] Author and Article Information
P. A. Engel

Department of Mechanical and Industrial Engineering, State University of New York at Binghamton, Binghamton, New York, 13902

Yun Ling

AMP Corp., Harrisburg, PA 17105

J. Electron. Packag 115(1), 22-27 (Mar 01, 1993) (6 pages) doi:10.1115/1.2909297 History: Revised September 15, 1992; Online April 28, 2008

Abstract

The coupling of a square base plate to another reinforcing plate is solved for torsional loads. Nondimensional analysis is carried out using thin plate theory. The distribution of connecting peripheral tie forces is shown to depend on the size ratio of the two plates, their rigidities, and the stiffness of the ties. Applications to twisted circuit cards with attached electronics modules are referred to.

Copyright © 1993 by The American Society of Mechanical Engineers
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