A New Method for Measuring Adhesion Strength of IC Molding Compounds

[+] Author and Article Information
Asao Nishimura, Naotaka Tanaka

Mechanical Engineering Research Laboratory, Hitachi, Ltd., Tsuchiura, Ibaraki, Japan

Isao Hirose

Production Engineering Research Laboratory, Nitto Denko Corp., Toyohashi, Aichi, Japan

J. Electron. Packag 114(4), 407-412 (Dec 01, 1992) (6 pages) doi:10.1115/1.2905473 History: Received June 01, 1992; Revised September 01, 1992; Online April 28, 2008


Adhesion strength evaluation of molding compounds is a critical issue in structural design and material selection for IC plastic packages. However, since conventional adhesion tests can only give apparent adhesion strengths, which include the effect of residual stress, their results cannot be used for design purposes. This paper proposes a new strength evaluation method which can experimentally separate residual stress from adhesion strength. In this method, three-point bending tests of ENF specimens are performed in both directions. Residual stress is then cancelled by simply averaging the apparent strengths for both directions. The method’s validity is verified by experiments and stress analyses of specimens composed of an IC molding compound and Alloy 42 lead frame material. Adhesion strength is expressed in terms of the stress intensity factor of the interface crack. It is confirmed that constant strengths can be obtained independently of specimen dimensions.

Copyright © 1992 by The American Society of Mechanical Engineers
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