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TECHNICAL BRIEFS

Thermoelastic Solutions for a Semi-Infinite Substrate With a Powered Electronic Device

[+] Author and Article Information
John H. Lau

Hewlett-Packard Company, Palo Alto, CA 94304

J. Electron. Packag 114(3), 353-358 (Sep 01, 1992) (6 pages) doi:10.1115/1.2905463 History: Received February 25, 1991; Revised May 20, 1992; Online April 28, 2008

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Copyright © 1992 by The American Society of Mechanical Engineers
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