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RESEARCH PAPERS

Thermal Stress Analysis of Pin Grid Array Structures: Module and Card Interactions

[+] Author and Article Information
P. A. Engel

Mechanical and Industrial Engineering Department, Binghamton University, Binghamton, NY 13902-6000

J. R. Webb

IBM Technology Laboratory, Endicott, NY 13760

J. Electron. Packag 114(3), 322-328 (Sep 01, 1992) (7 pages) doi:10.1115/1.2905458 History: Received September 27, 1991; Revised June 27, 1992; Online April 28, 2008

Abstract

While primary thermal stress analysis of pin grid arrays considers a nonflexible card and module delineating the structure, in this paper we consider the stress relief (resulting in a “secondary” force system) afforded by bending and stretching of the delineating plates. The primary axial force F, plate moments, M1 , M2 , and shear V are considered acting in radial planes, and the secondary pin forces P are solved by stipulating compatibility of deformations at the two pin ends. A collocation technique is used to evaluate the plate equations in polar symmetry. The contributions of transverse plate compliances, and in-plane compliances are evaluated numerically for a 50 mm ceramic module, and compared with known experimental force measurements.

Copyright © 1992 by The American Society of Mechanical Engineers
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