State-of-the-Art and Trends in the Thermal Packaging of Electronic Equipment

[+] Author and Article Information
Avram Bar-Cohen

Heat Transfer Laboratory, Department of Mechanical Engineering, University of Minnesota, Minneapolis, Minn. 55455

J. Electron. Packag 114(3), 257-270 (Sep 01, 1992) (14 pages) doi:10.1115/1.2905450 History: Received May 10, 1992; Revised June 22, 1992; Online April 28, 2008


The incessant improvements in IC technology have made it possible to conceptualize “information appliances” providing nearly unimaginable scalar, vector, and massively parallel information processing capability in small and relatively cheap computing platforms. The successful commercialization of such systems requires substantially shortened “time-to-market”, as well as dramatically reduced cost-of-ownership, and places extraordinary demands on packaging and physical design. A science-based physical design methodology, which can guide the development, selection, and evaluation of advanced packaging technology, will be needed to generate these sophisticated products. Mechanical engineers must play a major role in replacing the conventional “trial and error” development process with a science-based design methodology.

Copyright © 1992 by The American Society of Mechanical Engineers
Your Session has timed out. Please sign back in to continue.






Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In