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RESEARCH PAPERS

Electronic Materials and Structures for Multichip Modules

[+] Author and Article Information
H. K. Charles

Applied Physics Laboratory, The Johns Hopkins University, Laurel, MD 20723

J. Electron. Packag 114(2), 226-233 (Jun 01, 1992) (8 pages) doi:10.1115/1.2906422 History: Received August 01, 1991; Online April 28, 2008

Abstract

Multichip modules are rapidly becoming a major thrust in electronic packaging technology. Because of the high density and high performance nature of the electronic devices packaged in multichip modules, stringent new demands are being placed on materials, interconnect, and packaging structures. A systematic review of the materials and material structures for multichip modules is presented along with their associated physical and electronic properties. Particular emphasis is placed on new materials and their potential impact on multichip module packaging. Examples of their use in the fabrication of multichip modules and advanced chip-on-board systems are described.

Copyright © 1992 by The American Society of Mechanical Engineers
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