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RESEARCH PAPERS

Elasto-Plastic Large Deflection Analysis of a Copper Film

[+] Author and Article Information
J. H. Lau

Hewlett-Packard Company, Palo Alto, CA 94304

J. Electron. Packag 114(2), 221-225 (Jun 01, 1992) (5 pages) doi:10.1115/1.2906421 History: Received August 01, 1991; Online April 28, 2008

Abstract

The ductility of a copper film has been determined by an elastoplastic large deflection finite element method. The effective stress and incremental plastic strain and pressure-deflection curves of the copper film have also been provided for a better understanding of its mechanical behavior. Furthermore, for engineering practice convenience, the ductility and effective stress of the copper film have been plotted as functions of measurable variables, i.e., applied pressure and deflection at the center of the bulge.

Copyright © 1992 by The American Society of Mechanical Engineers
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