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RESEARCH PAPERS

Effects of Thickness on Thermal Stresses in a Thin Solder or Adhesive Layer

[+] Author and Article Information
An-Yu Kuo, Kuan-Luen Chen

Structural Integrity Associates, Inc., San Jose, CA 95118

J. Electron. Packag 114(2), 199-202 (Jun 01, 1992) (4 pages) doi:10.1115/1.2906418 History: Received August 01, 1991; Online April 28, 2008

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Copyright © 1992 by The American Society of Mechanical Engineers
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