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RESEARCH PAPERS

Experimental and Analytical Studies of 28-Pin Thin Small Outline Package (TSOP) Solder-Joint Reliability

[+] Author and Article Information
J. Lau, S. Erasmus

Hewlett-Packard Co., Palo Alto, CA 94303

S. Golwalkar, R. Surratt, P. Boysan

Intel Corp., Folsom, CA 95630

J. Electron. Packag 114(2), 169-176 (Jun 01, 1992) (8 pages) doi:10.1115/1.2906414 History: Received August 01, 1991; Online April 28, 2008

Abstract

The reliability of 0.5 mm pitch, 28-Pin Thin Small Outline Package (TSOP) solder joints has been studied by experimental temperature cycling and a cost-effective 3-D nonlinear finite element analysis. Temperature cycling results have been presented as a Weibull distribution, and an acceleration factor has been established for the failure rate at operating conditions. Thermal fatigue life of the corner solder joints has been estimated based on the calculated plastic strain, Coffin-Manson equation, and isothermal fatigue data on solders. A correlation between the experimental and analytical results has also been made. Furthermore, failure analysis of the solder joints has been performed using Scanning Electron Microscopy (SEM) and an optical method.

Copyright © 1992 by The American Society of Mechanical Engineers
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