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RESEARCH PAPERS

Fatigue Lives on 60Sn/40Pb Solder Joints Made With Different Cooling Rates

[+] Author and Article Information
Z. Mei, J. W. Morris

Center for Advanced Materials, Lawrence Berkeley Laboratory and Department of Materials Science and Mineral Engineering, University of California, Berkeley, CA 94720

J. Electron. Packag 114(2), 104-108 (Jun 01, 1992) (5 pages) doi:10.1115/1.2906404 History: Received August 01, 1991; Online April 28, 2008

Abstract

This paper reports the results of a study on the effect of the cooling rate during solidification on the isothermal shear-fatigue life of 60Sn/40Pb solder joints. Solder joints are made with three different initial microstructures by quenching, air-cooling, and furnace-cooling. The test results show that the quench-solidified solder joints have isothermal fatigue lives of about twice long as those of the furnace cooled solder joints tested at 20°C and 65°C with the straining rates of about 10−4 per s. These results are ascribed to the refined grain size and less lamellar phase morphology that results on increasing the cooling rate.

Copyright © 1992 by The American Society of Mechanical Engineers
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