0
TECHNICAL BRIEFS

Structural Analyses of Spacecraft Electronic Packages

[+] Author and Article Information
S. Kannappan, V. Kunukkassril

General Electric Company, Princeton, NJ 08543

J. Electron. Packag 114(1), 96-99 (Mar 01, 1992) (4 pages) doi:10.1115/1.2905449 History: Received September 01, 1990; Revised December 20, 1991; Online April 28, 2008

Abstract

The spacecraft electronic assemblies are subjected to severe environmental conditions during testing, launching and during orbit mission. The success of the mission depends upon the proper functioning of these critical electronic modules. The structural analyses using Finite Element Methods (FEM) assure the integrity of these components. A typical box, Array Drive Electronics (ADE), for TIROS satellites [1] is discussed in this article. The NASTRAN software was used to perform the stress and modal analyses of the box assembly with five circuit boards, covers and mounting feet. The stress analysis was performed for a static solution. As a conservative loading, 3 sigma load factor was used in the calculation of the acceleration values from the random vibration test conditions. Margins of safety were calculated. Design and material changes were recommended. The mode shapes fall in to three groups as explained in the text.

Copyright © 1992 by The American Society of Mechanical Engineers
Your Session has timed out. Please sign back in to continue.

References

Figures

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In