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RESEARCH PAPERS

Thermal Effects During Infrared Solder Reflow—Part I: Heat Transfer Mechanisms

[+] Author and Article Information
N. J. Fernandes, T. L. Bergman, G. Y. Masada

Department of Mechanical Engineering, The University of Texas at Austin, Austin, Texas 78712

J. Electron. Packag 114(1), 41-47 (Mar 01, 1992) (7 pages) doi:10.1115/1.2905440 History: Received September 28, 1990; Revised November 08, 1991; Online April 28, 2008

Abstract

An experimental study has been conducted to reveal the relevant heat transfer mechanisms which exist within an infrared reflow oven. Simulated card assemblies are used and their transient thermal responses, induced by combined radiative and convective heating, are measured. A simple numerical model is developed with which relevant heat transfer mechanisms are identified and quantified. The study shows that radiative and mixed convective heat transfer processes induce a variety of system thermal responses. Model predictions, which incorporate measured forced convection heat transfer coefficients and accurate descriptions of surface-to-surface radiative exchange, are in excellent agreement with experimental data for cases where the thermally induced buoyancy forces within the oven air are relatively small. The results of the experimental and analytical study provide guidelines for the development of more sophisticated models of the infrared reflow process.

Copyright © 1992 by The American Society of Mechanical Engineers
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