0
RESEARCH PAPERS

A Bonded Joint Analysis for Surface Mount Components

[+] Author and Article Information
S. E. Yamada

Molex Japan Co., Ltd., Tokyo, Japan

J. Electron. Packag 114(1), 1-7 (Mar 01, 1992) (7 pages) doi:10.1115/1.2905436 History: Received April 04, 1991; Revised October 10, 1991; Online April 28, 2008

Abstract

To gain a better understanding of the stress state in surface mount joints and their design considerations, an analysis method of bonded joints is developed and consequently three parameters that govern the stress distribution are identified. The solutions are obtained in terms of trigonometric and hyperbolic functions, and then applied to a simplified surface mount device. Contrary to general belief that the surface mount joints are mainly subjected to shear, it is shown that a peel stress also exists in a joint. Especially in a short joint used to connect stiff members as in direct mounting of chips and chip carriers, the magnitude of the peel stress is far greater than the shear stress.

Copyright © 1992 by The American Society of Mechanical Engineers
Your Session has timed out. Please sign back in to continue.

References

Figures

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In