Quasi-Static Modeling of the Self-Alignment Mechanism in Flip-Chip Soldering—Part I: Single Solder Joint

[+] Author and Article Information
S. K. Patra, Y. C. Lee

Department of Mechanical Engineering, University of Colorado, Boulder, Colo. 80309-0427

J. Electron. Packag 113(4), 337-342 (Dec 01, 1991) (6 pages) doi:10.1115/1.2905417 History: Received September 01, 1990; Revised June 07, 1991; Online April 28, 2008


A three-dimensional mathematical model simulating the self-alignment mechanism in the flip-chip soldering of a single joint has been developed. Based on the principle of energy minimization, it calculates the quasi-static surface profiles defined by the size of the solder pads, the solder volume, the surface tension coefficient, the vertical loading and the misalignment. The model is capable of calculating initial, intermediate and final profiles and their associated restoring forces during the solder reflow. It can provide the guidelines to improve the assembly yield and the stress-related reliability of the flip-chip soldering technology.

Copyright © 1991 by The American Society of Mechanical Engineers
Your Session has timed out. Please sign back in to continue.






Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In