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TECHNICAL BRIEFS

Analysis of Transient State Temperature Distribution in the Thyristor Packaging

[+] Author and Article Information
A. Skorek, V. Rajagopalan

Université du Québec à Trois-Rivières, Département d’ingénierie, Groupe de Recherche en Electronique Industrielle, Québec, Canada G9A 5H7

A. J. Jordan

Faculty of Electrical Engineering, Technical University of Bialystok, 15-893 Bialystok, Poland

J. Electron. Packag 113(3), 325-328 (Sep 01, 1991) (4 pages) doi:10.1115/1.2905414 History: Received June 04, 1990; Revised March 27, 1991; Online April 28, 2008

Abstract

Transient state temperature distribution in a power electronics module comprising two thyristors was computed using a finite element method (FEM). An optimal positioning of one of the thyristors with respect to another was obtained based on the minimization of two norms ‖T ‖2 and ‖T t ‖∞. The results obtained from the simulation are compared with those measured using thermocouple techniques; the agreement between these results is found to be good.

Copyright © 1991 by The American Society of Mechanical Engineers
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