0
RESEARCH PAPERS

Fatigue Analysis of a Ceramic Pin Grid Array Soldered to an Orthotropic Epoxy Substrate

[+] Author and Article Information
J. Lau, D. Rice, S. Erasmus

Hewlett-Packard Co., Palo Alto, CA 94304

R. Subrahmanyan

Motorola, Inc., Phoenix, AZ 85008

C. Li

Department of Material Science & Engineering, Cornell University, Ithaca, NY 14853

J. Electron. Packag 113(2), 138-148 (Jun 01, 1991) (11 pages) doi:10.1115/1.2905379 History: Received April 03, 1991; Online April 28, 2008

Abstract

Thermal stresses and strains in the solder joints and plated-through-hole (PTH) copper pads/barrels of a pin-grid array (PGA) assembly under thermal cycling conditions have been determined in the present study. There are two major systems of thermal stresses/strains acting at the solder joint and copper. One is the transverse shear and vertical normal stress/strain due to the local thermal expansion mismatch between the pin, solder, copper, and FR-4. The other is the horizontal normal stress/strain due to the global thermal expansion mismatch between the ceramic PGA and the FR-4 printed circuit board (PCB). The effects of the local thermal expansion mismatch on the reliability of solder joint and PTH copper have been determined using a 3-D orthotropic-elastoplastic finite element method. The effects of the global thermal expansion mismatch on the reliability of solder joint and PTH copper have been determined by fatigue experiments. Fatigue life of the solder joint and PTH copper was then estimated based on the calculated strains and the fatigue data on solders and coppers.

Copyright © 1991 by The American Society of Mechanical Engineers
Your Session has timed out. Please sign back in to continue.

References

Figures

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In