Superplastic Creep of Eutectic Tin-Lead Solder Joints

[+] Author and Article Information
Z. Mei, J. W. Morris

Center for Advanced Materials, Lawrence Berkeley Laboratory and Department of Materials Science and Mineral Engineering, University of California, Berkeley, CA 94720

M. C. Shine

Digital Equipment Corporation, Cupertino, CA 95014

J. Electron. Packag 113(2), 109-114 (Jun 01, 1991) (6 pages) doi:10.1115/1.2905375 History: Received August 01, 1990; Revised February 01, 1991; Online April 28, 2008


The creep behavior of air-cooled and liquid nitrogen-quenched soldered joints of 60/40 Sn-Pb at 65°C has been studied. The stress exponent, n, in the power law, γ̇ (steady state strain rate) ∝σn (applied stress), changes from a value of about 6 to values of 2 to 3, as γ̇ decreases below 10−4 in/in per second. This result, combined with the authors’ previous stepped load creep test results, indicates a transition of the creep deformation mechanism from conventional dislocation climb to superplastic grain boundary sliding. The superplastic creep of the soldered joints is ascribed to their non-lamellar microstructure due to their fast cooling rate. During creep deformation, recrystallization of the soldered joints occurs, causing softening.

Copyright © 1991 by The American Society of Mechanical Engineers
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