Thermoelastic Solutions for a Finite Substrate With an Electronic Device

[+] Author and Article Information
J. H. Lau

Hewlett-Packard Company, Palo Alto, CA 94304

J. Electron. Packag 113(1), 84-88 (Mar 01, 1991) (5 pages) doi:10.1115/1.2905372 History: Received December 19, 1990; Online April 28, 2008


Sneddon and Lockett obtained a fairly general solution to the steady-state thermoelastic problem for the thick plate (Sneddon and Lockett, 1960). In particular, they have obtained the exact solutions for axially symmetrical temperature distributions on the upper surface of the thick plate. In this note, their exact solution will be applied to an electronic problem, namely, a chip on a substrate with finite thickness. Emphasis is placed on the generation of dimensionless charts for the temperature, displacement, and stress distributions in the substrates. These charts are not only useful for designing substrates but also can be used to verify finite element analysis procedures.

Copyright © 1991 by The American Society of Mechanical Engineers
Your Session has timed out. Please sign back in to continue.






Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In