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RESEARCH PAPERS

Forced Convection Air Cooling of Simulated Low Profile Electronic Components: Part 2—Heat Sink Effects

[+] Author and Article Information
G. L. Lehmann, J. Pembroke

Department of Mechanical Engineering, State University of New York at Binghamton, Binghamton, New York 13901

J. Electron. Packag 113(1), 27-32 (Mar 01, 1991) (6 pages) doi:10.1115/1.2905363 History: Received November 21, 1989; Revised October 12, 1990; Online April 28, 2008

Abstract

Forced convection air cooling of an array of low profile, card-mounted components has been investigated. A simulated array is attached to one wall of a low aspect ratio duct. This is the second half of a two-part study. In this second part the presence of a longitudinally finned heat sink is considered. The heat sink is a thermally passive “flow disturbance”. Laboratory measurements of the heat transfer rates downstream of the heat sink are reported and compared with the measured values which occur when no heat sinks are present. Data are presented for three heat sink geometries subject to variations in channel spacing and flow rate. In the flow range considered laminar, transitional and turbulent heat transfer behavior has been observed. The presence of a heat sink appears to “trip” the start of transition at lower Reynolds numbers than when no heat sinks are present. A Reynolds number based on component length provides a good correlation of the heat transfer behavior due to variations in flow rate and channel spacing. Heat transfer is most strongly effected by flow rate and position relative to the heat sink. Depending on the flow regime (laminar or turbulent) both relative enhancement and reductions in the component Nusselt number have been observed. The impact of introducing a heat sink is greatest for flow rates corresponding to transitional behavior.

Copyright © 1991 by The American Society of Mechanical Engineers
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