0
RESEARCH PAPERS

Thermal Analysis of a Ceramic Package for Microelectronic Applications

[+] Author and Article Information
H. Rajala, M. Renksizbulut

University of Waterloo, Mechanical Engineering Department, Waterloo, Ontario, N2L 3G1, Canada

J. Electron. Packag 112(4), 338-344 (Dec 01, 1990) (7 pages) doi:10.1115/1.2904387 History: Received November 08, 1989; Revised August 23, 1990; Online April 28, 2008

Abstract

Thermal analysis of a ceramic microelectronic package has been performed for six configurations under prescribed free and forced convective conditions. The corresponding three-dimensional temperature fields, and thus, the complex heat flow patterns within the package have been determined. The predicted temperatures compare favorably with the experimental data obtained using a 44-lead quad package. It is observed that, in forced convection, there is no significant reduction in the junction temperatures when the package is mounted in the cavity-down configuration. In free convection, filling the cavity with helium also results in small reductions in temperatures. On the other hand, conditions existing at the back surface of the board have a fairly significant effect on the junction temperature. Although essentially negligible in the forced convection cases, thermal radiation accounts for about one-fifth of the total heat transfer from the package in the free convection cases.

Copyright © 1990 by The American Society of Mechanical Engineers
Your Session has timed out. Please sign back in to continue.

References

Figures

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In