Effects of Heat Intensity, Size, and Position of the Components on Temperature Distribution Within an Electronic PCB Enclosure

[+] Author and Article Information
Z.-G. Du, E. Bilgen

Ecole Polytechnique, Montreal P.Q. H3C 3A7 Canada

J. Electron. Packag 112(3), 249-254 (Sep 01, 1990) (6 pages) doi:10.1115/1.2904374 History: Received October 10, 1989; Revised May 18, 1990; Online April 28, 2008


Natural convection heat transfer has been studied in a sealed small PCB enclosure of three heated components which are mounted on a PCB plate within a large console cooled by vented airflow. A two-dimensional laminar flow model is used with appropriate boundary conditions. Detailed influences of each parameter, such as intensity, size, and position of the heaters on temperature and flow distributions within the enclosure have been studied. The favorable component arrangements for various cases have been determined.

Copyright © 1990 by The American Society of Mechanical Engineers
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