A Study of Forced Convection Direct Air Cooling in the Downstream Vicinity of Heat Sinks

[+] Author and Article Information
G. L. Lehmann

Department of Mechanical Engineering, State University of New York at Binghamton, Binghamton, N.Y. 13901

S. J. Kosteva

IBM Corporation, Endicott, N.Y. 13760

J. Electron. Packag 112(3), 234-240 (Sep 01, 1990) (7 pages) doi:10.1115/1.2904372 History: Received September 15, 1989; Revised March 08, 1990; Online April 28, 2008


An experimental study of forced convection heat transfer is reported. Direct air cooling of an electronics packaging system is modeled by a channel flow, with an array of uniformly sized and spaced elements attached to one channel wall. The presence of a single or complete row of longitudinally finned heat sinks creates a modified flow pattern. Convective heat transfer rates at downstream positions are measured and compared to that of a plain array (no heat sinks). Heat transfer rates are described in terms of adiabatic heat transfer coefficients and thermal wake functions. Empirical correlations are presented for both variations in Reynolds number (5000 < Re < 20,000) and heat sink geometry. It is found that the presence of a heat sink can both enhance and degrade the heat transfer coefficient at downstream locations, depending on the relative position.

Copyright © 1990 by The American Society of Mechanical Engineers
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