Solder Joint Formation in Surface Mount Technology—Part II: Design

[+] Author and Article Information
S. M. Heinrich

Civil Engineering, Marquette University, Milwaukee, WI 53233

N. J. Nigro, A. F. Elkouh

Mechanical Engineering, Marquette University, Milwaukee, WI 53233

P. S. Lee

Allen-Bradley, A Rockwell International Company, Milwaukee, WI 53204

J. Electron. Packag 112(3), 219-222 (Sep 01, 1990) (4 pages) doi:10.1115/1.2904370 History: Received December 29, 1989; Revised June 18, 1990; Online April 28, 2008


In this paper dimensionless design curves relating fillet height and length to joint cross-sectional area are presented for surface-mount solder joints. Based on an analytical surface tension model, the advantage of these dimensionless curves is that they may be used for arbitrary values of solder density and surface tension. The range of applicability of previously developed approximate formulae for predicting joint dimensions is also investigated. A simple example problem is included to illustrate the use of both the design curves and the approximate formulae.

Copyright © 1990 by The American Society of Mechanical Engineers
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