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RESEARCH PAPERS

Solder Joint Formation in Surface Mount Technology—Part I: Analysis

[+] Author and Article Information
S. M. Heinrich

Civil Engineering, Marquette University, Milwaukee, WI 53233

A. F. Elkouh, N. J. Nigro

Mechanical Engineering, Marquette University, Milwaukee, WI 53233

Ping S. Lee

Allen-Bradley, A Rockwell International Company, Milwaukee, WI 53204

J. Electron. Packag 112(3), 210-218 (Sep 01, 1990) (9 pages) doi:10.1115/1.2904369 History: Received December 29, 1989; Revised June 18, 1990; Online April 28, 2008

Abstract

An analytical model of solder joint formation during a surface mount reflow process is developed in the present paper, and the solution is obtained in an explicit integral form. For two limiting cases—infinitesimal and infinite solder areas—the solution is expressed in closed form. Numerical results illustrate the influence of the process parameters (surface tension, density, and cross-sectional area of the molten solder, and the contact angles between the solder andpretinning) on joint shape and overall fillet dimensions. Comparisons between theoretical predictions and laboratory data show excellent agreement.

Copyright © 1990 by The American Society of Mechanical Engineers
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