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RESEARCH PAPERS

Solder-Glass Attachment in Cerdip/Cerquad Packages: Thermally Induced Stresses and Mechanical Reliability

[+] Author and Article Information
E. Suhir

AT&T Bell Laboratories, Murray Hill, NJ 07974

B. Poborets

AT&T Bell Laboratories, Allentown, PA 18103

J. Electron. Packag 112(3), 204-209 (Sep 01, 1990) (6 pages) doi:10.1115/1.2904368 History: Received January 26, 1990; Revised June 08, 1990; Online April 28, 2008

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Copyright © 1990 by The American Society of Mechanical Engineers
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