0
RESEARCH PAPERS

Sensor Technology for ZIF Connectors

[+] Author and Article Information
T. Chikazawa, C. K. Lim, H. V. Luu, M. D. Toda, J. T. Vogelmann

IBM STD Endicott Technology Lab, Endicott, NY 13760

J. Electron. Packag 112(3), 187-191 (Sep 01, 1990) (5 pages) doi:10.1115/1.2904365 History: Online April 28, 2008

Abstract

A zero insertion force (ZIF) connector was designed with the requirement of maintaining a specified contact normal force and wipe sufficient to achieve reliable electrical performance. In order to evaluate the design during its development and to monitor its quality during full scale production, a nondestructive sensor was developed to measure the force and wipe simultaneously. The sensor was built into a steel coupon, and assembled in a benchtop fixture that facilitates ease of alignment and measurement of the contact springs. The coupon can also be mounted on a printed circuit card to enable “in-situ” measurement of connectors assembled in the electronic “cage-like” package. Prior to sensor availability, the connector vendors as well as IBM had other methods of measuring contact force and wipe. These measures had varying accuracies, and were difficult to correlate. The sensor described in this paper was duplicated in order for the vendors and IBM to have a consistent measurement tool.

Copyright © 1990 by The American Society of Mechanical Engineers
Your Session has timed out. Please sign back in to continue.

References

Figures

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In