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RESEARCH PAPERS

Strength Analysis of Surface Mounted Assemblies Under Bending and Twisting Loads

[+] Author and Article Information
Tin-Lup Wong, Karl K. Stevens, Junshi Wang

Department of Mechanical Engineering, Florida Atlantic University, Boca Raton, FL 33431

Wayne Chen

Northern Telecom Electronics Inc., West Palm Beach, FL 33407

J. Electron. Packag 112(2), 168-174 (Jun 01, 1990) (7 pages) doi:10.1115/1.2904358 History: Online April 28, 2008

Abstract

Simulations of bending and twisting of surface mounted assemblies have been performed using the hybrid analytical/experimental analysis approach, and the results are presented. Analytical analyses were combined with experimental load-deformation characteristics of the surface mounted assemblies to predict the maximum allowable loadings and deflections that the surface mounted assemblies can withstand before incurring failures. The simulation results were in close agreement with the real loading situations.

Copyright © 1990 by The American Society of Mechanical Engineers
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