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RESEARCH PAPERS

Thermal Stresses in Compliantly Joined Materials

[+] Author and Article Information
J. C. Glaser

Applied Mechanics, Naval Systems Division, FMC Corporation, Minneapolis, MN 55459

J. Electron. Packag 112(1), 24-29 (Mar 01, 1990) (6 pages) doi:10.1115/1.2904335 History: Received January 03, 1990; Online April 28, 2008

Abstract

In the past several years there have been a number of papers published which provide closed-form solutions for the stresses in bonded layers of materials. These closed-form solutions offer a rapid method to obtain first-order stresses for materials which are joined together and the compliant layer between them. However, before using them, it is desirable to have some feeling as to the accuracy of the results from these closed-form equations. Comparisons between these analytical relations and other approaches found in published works on bonding and to finite element solutions for several example problems are given. An attempt is made to qualify these closed-form equations in terms of their accuracy, as compared to other methods of analysis. The effects of finite element mesh refinement on the material interface stress results are also given.

Copyright © 1990 by The American Society of Mechanical Engineers
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