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RESEARCH PAPERS

Structural Analysis For Circuit Card Systems Subjected to Bending

[+] Author and Article Information
P. A. Engel

Department of Mechanical and Industrial Engineering, SUNY Binghamton, Binghamton, NY 13901

J. Electron. Packag 112(1), 2-10 (Mar 01, 1990) (9 pages) doi:10.1115/1.2904336 History: Received December 27, 1989; Online April 28, 2008

Abstract

The determination of stress in a typical module/lead/card system is generally a very complex task. In the present paper a new engineering modeling approach is given, high-lighting simple, approximate calculations of the most significant system responses. Simplified patterns of plate action are construed using strips, including the module, in both x and y directions. Relationships were obtained for various shapes and sizes of card and module (e.g., square and rectangular); various systems of load and support conditions; various designs of modules (e.g., double-sided and stacked) and leads; clustered groups of modules, etc. The finite element method was used both to corroborate results of the theoretical approach, and to provide an “experimental” technique for the major response quantities.

Copyright © 1990 by The American Society of Mechanical Engineers
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