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TECHNICAL BRIEFS

A Note on the Calculation of Thermal Stresses in Electronic Packaging by Finite Element Methods

[+] Author and Article Information
J. H. Lau

Hewlett-Packard Co., Palo Alto, CA 94304

J. Electron. Packag 111(4), 313-320 (Dec 01, 1989) (8 pages) doi:10.1115/1.3226554 History: Received August 20, 1989; Online November 09, 2009

Abstract

The purpose of this paper is to point out a very common mistake made in determining the thermal stresses in composite structures by finite element methods. Furthermore, a simple technique to obtain the correct thermal stresses is recommended.

Copyright © 1989 by ASME
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