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RESEARCH PAPERS: Papers on Physical Design

Designing Electronic Products to Withstand the Distribution Environment

[+] Author and Article Information
R. Peache, J. Gasper

Product and Package Engineering Analysis, Wang Laboratories, Inc., Lowell, Mass. 01851

D. Privitera

Product Design, Wang Laboratories, Inc., Lowell, Mass. 01851

D. Heasty

Package Design Engineering, Wang Laboratories, Inc., Lowell, Mass. 01851

J. Electron. Packag 111(4), 294-298 (Dec 01, 1989) (5 pages) doi:10.1115/1.3226550 History: Received October 03, 1989; Online November 09, 2009

Abstract

During the past few years product mechanical shock fragility analysis has become an accepted part of the product design cycle at Wang Laboratories, Inc. This analysis is used to insure that the product has sufficient strength to work in the user environment without problem, and to survive the shipping environment from Wang to the customer without requiring excessively expensive shipping packaging. In some cases it is possible to make relatively inexpensive changes in the product which increase the mechanical shock resistance of that product. The cost of these changes is weighed against the cost of the amount of cushioning and related recurring costs needed in the shipping package to provide protection for the lower shock level the unmodified product is capable of withstanding. If the cost of product modification is lower than the cost of the increased package materials, freight and storage (increased cube), the modification is made to the product. A brief background of shock testing products is given, with particular attention to the use of ASTM D 3332. This process is presented as a specific case study on a recently developed CRT monitor.

Copyright © 1989 by ASME
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