Calculated Interfacial Stresses in Elongated Bimaterial Plates Subjected to Bending

[+] Author and Article Information
E. Suhir

AT&T Bell Laboratories, Murray Hill, New Jersey 07974

J. Electron. Packag 111(4), 277-281 (Dec 01, 1989) (5 pages) doi:10.1115/1.3226547 History: Received May 13, 1989; Revised August 15, 1989; Online November 09, 2009


In this analysis we suggest a simple engineering method for the evaluation of the interfacial stresses in elongated bimaterial plates subjected to bending. The taken approach enables one to satisfy the boundary conditions at the plate’s ends within the framework of the elementary beam, or long-and-narrow plate, theory. The analysis is carried out in application to bending on a circular mandrel, which is regarded by many reliability engineers as a suitable test vehicle for the evaluation of the mechanical performance of the attachment material in adhesively bonded and soldered assemblies in electronic packaging.

Copyright © 1989 by ASME
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