Finite Element Modeling for Optimizing Hermetic Package Reliability

[+] Author and Article Information
J. H. Lau, L. B. Lian-Mueller

Hewlett-Packard Company, Palo Alto, CA 94304

J. Electron. Packag 111(4), 255-260 (Dec 01, 1989) (6 pages) doi:10.1115/1.3226544 History: Received September 01, 1988; Revised June 02, 1989; Online November 09, 2009


The thermal stresses in microwave packages are studied by the finite element method. Emphasis is placed on the effects of material construction and design on the reliability of very small hermetic packages. Three different microwave packages have been designed and six finite element models (two for each design) have been analyzed. To verify the validity of the finite element results, some leak tests have been performed and the results agree with the analytical conclusions. The results presented herein should provide a better understanding of the thermal behavior of hermetic packages and should be useful for their optimal design.

Copyright © 1989 by ASME
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