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RESEARCH PAPERS

Combined Moisture and Thermal Stresses Failure Mode in a PLCC

[+] Author and Article Information
Y. Kornblum

Department of Mechanical Engineering, University of Minnesota, Minneapolis, MN 55455

J. C. Glaser

FMC Corporation, Minneapolis, MN 55459

J. Electron. Packag 111(4), 249-254 (Dec 01, 1989) (6 pages) doi:10.1115/1.3226543 History: Received March 27, 1989; Revised September 08, 1989; Online November 09, 2009

Abstract

A finite element analysis has been conducted to provide a new explanation for PLCC cracking during soldering and develop a working model for the cracking phenomena. The model shows that cracking is due to strong moisture, temperature and material properties gradients that are developed in the body of the PLCC and that the moisture is not accumulated in a free state under the pad. Instead it is distributed in three distinct regions in the PLCC encapsulation. The results of this model indicate high stress at points where cracks were reported to occur.

Copyright © 1989 by ASME
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