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RESEARCH PAPERS

Thermally Conductive Ceramics for Electronic Packaging

[+] Author and Article Information
D. Suryanarayana

Systems Technology Division, IBM Corporation, Endicott, NY 13760

J. Electron. Packag 111(3), 192-198 (Sep 01, 1989) (7 pages) doi:10.1115/1.3226533 History: Received March 27, 1989; Revised June 09, 1989; Online November 09, 2009

Abstract

A survey was conducted on the physical properties of several new ceramic systems, such as carbides, borides, oxides, and nitrides, as they appeared in recent literature, and they are briefly reviewed. A few new ceramic materials, such as BeO, BN, AlN, and SiC-BeO, possess superior thermal properties when compared to the alumina (Al2 O3 ) ceramics used in electronic packaging. Among these, the aluminum nitride (AlN) has emerged as unique material that can replace alumina in future electronic packaging for improved thermal performance and reliability.

Copyright © 1989 by ASME
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