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RESEARCH PAPERS

Ceramic Materials for Electronic Packaging

[+] Author and Article Information
E. M. Rabinovich

AT&T Bell Laboratories, Murray Hill, New Jersey 07974

J. Electron. Packag 111(3), 183-191 (Sep 01, 1989) (9 pages) doi:10.1115/1.3226532 History: Received January 19, 1989; Revised May 23, 1989; Online November 09, 2009

Abstract

The paper reviews ceramic materials that are used or can be used in electronic packaging. Main attention is given in relatively new packaging materials such as highly thermal conductive AlN and SiC (BeO-doped) or low-firing cordierite and spodumene glass-ceramics. Application of sol-gel processes in preparation of ceramic powders is discussed.

Copyright © 1989 by ASME
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