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RESEARCH PAPERS

Analytical Modeling in Electronic Packaging Structures: Its Merits, Shortcomings and Interaction With Experimental and Numerical Techniques

[+] Author and Article Information
E. Suhir

AT&T Bell Laboratories, Murray Hill, New Jersey 07974

J. Electron. Packag 111(2), 157-161 (Jun 01, 1989) (5 pages) doi:10.1115/1.3226522 History: Received February 15, 1989; Online November 09, 2009

Abstract

We discuss the role of theoretical and, in particular, analytical modeling in mechanical problems for electronic packaging, including requirements for a feasible theoretical model, how such a model is developed, the role of mathematics, what can be gained by using theoretical modeling, as well as the interaction of analytical, numerical (computer-aided) and experimental models. Peculiarities of theoretical modeling in Structural Analysis are also briefly discussed.

Copyright © 1989 by ASME
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