An Overview of Integrated Circuit Device Encapsulants

[+] Author and Article Information
C. P. Wong

AT&T Bell Laboratories, Princeton, NJ 08540

J. Electron. Packag 111(2), 97-107 (Jun 01, 1989) (11 pages) doi:10.1115/1.3226528 History: Received January 19, 1989; Revised March 30, 1989; Online November 09, 2009


The rapid development of integrated circuit technology from small-scale integration (SSI) to very large scale integration (VLSI) has had great technological and economical impact on the electronics industry. The exponential growth of the number of components per IC chip, the exponential decrease of device dimensions, and the steady increase in IC chip size have imposed stringent requirements, not only on the IC physical design and fabrication, but also on IC encapsulants. This report addresses the purpose of encapsulation, encapsulation techniques, and a general overview of the application of inorganic and organic polymer materials as electronic device encapsulants.

Copyright © 1989 by ASME
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