Mechanical Analysis for Thermal Grease Enhanced Modules Enclosing a Silicon Chip

[+] Author and Article Information
P. A. Engel, D. H. Strope, T. E. Wray

IBM Technology Laboratory, Endicott, NY 13760

J. Electron. Packag 111(2), 90-96 (Jun 01, 1989) (7 pages) doi:10.1115/1.3226527 History: Received November 10, 1988; Revised February 04, 1989; Online November 09, 2009


In metallized ceramic technology substantial mechanical stresses arise in assembly, insertion and cyclic thermal loading of thermally enhanced modules. This paper describes some experimental and analytical investigations performed for safeguarding the structural integrity of modules in which heat conduction from the chip to the module cap was enhanced by a “thermal grease” compound.

Copyright © 1989 by ASME
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