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RESEARCH PAPERS

Strain-Life Behavior in 60/40 Solder

[+] Author and Article Information
H. D. Solomon

G. E. Corporate Research and Development Center, Schenectady, NY 12301

J. Electron. Packag 111(2), 75-82 (Jun 01, 1989) (8 pages) doi:10.1115/1.3226525 History: Received September 27, 1988; Revised March 31, 1989; Online November 09, 2009

Abstract

This paper describes low cycle fatigue test run at −50°C, 35°C, 125°C, and 150°C on thin 60 Sn/40 Pb solder joints, tested in simple shear. The low cycle fatigue behavior was found to be a function of the criteria used to define the fatigue life. Different drops in the hysteresis load, measured when a constant plastic strain is being applied, was used to define failure. Not only was the magnitude of the fatigue life a function of the load drop definition for failure, it was also found that the Coffin-Manson low cycle fatigue exponent was a function of this definition. The choice of dependent variable for the curve fitting procedure used to calculate the Coffin-Manson exponent is also considered.

Copyright © 1989 by ASME
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