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RESEARCH PAPERS

An Interfacing Software Package for Thermal Analysis: Application to Microelectronics

[+] Author and Article Information
A. Hadim, A. T. Chang

Department of Mechanical Engineering, Stevens Institute of Technology, Hoboken, NJ 07030

A. Chu, A. Yskamp

Allied Signal Aerospace, Computer-Aided Engineering Center, Teterboro, NJ 07608

J. Electron. Packag 111(1), 54-60 (Mar 01, 1989) (7 pages) doi:10.1115/1.3226509 History: Received October 21, 1988; Online November 09, 2009

Abstract

A software package called: INterfacing Software for Thermal ANalysis (INSTAN) is developed to interface finite element general purpose programs with finite-difference thermal network analyzers for detailed analysis of complex thermal problems. The finite element mesh is used to generate the thermal network representation of the problem. INSTAN performs automatically the thermal network calculations and generates a complete input file for the thermal analysis program. The INSTAN software package is a powerful modeling tool which uses the preprocessing and postprocessing features available in a finite element program. It has also the flexibility and heat transfer calculation capabilities of a finite-difference program. It can handle problems with three-dimensional irregular geometries, time and temperature dependent properties, and anisotropic materials. The software possesses enhanced capabilities that make it suitable for thermal analysis of microelectronic equipment.

Copyright © 1989 by ASME
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