Sensible Heating and Boiling Incipience in Free-Falling Dielectric Liquid Films

[+] Author and Article Information
William J. Marsh, Issam Mudawar

Boiling and Two-Phase Flow Laboratory, School of Mechanical Engineering, Purdue University, West Lafayette, IN 47907

J. Electron. Packag 111(1), 46-53 (Mar 01, 1989) (8 pages) doi:10.1115/1.3226508 History: Received October 21, 1988; Online November 09, 2009


Controlling boiling incipience is of paramount importance for reliable operation of liquid-cooled microelectronic heat sources during power transients. This study focuses on heat transfer from a simulated multichip module to a falling film. Experiments have been performed to develop an understanding of the influence of surface tension and wetting characteristics on sensible heat transfer and boiling incipience in free-falling dielectric (FC-72) liquid films. The boiling results reveal that the vanishingly small contact angle of FC-72 precludes the application of correlations currently employed to predict incipience. Also, the temperature excursion commonly encountered upon boiling incipience in wetting fluids was nonexistent in all the experimental runs.

Copyright © 1989 by ASME
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