Thermal Stress Analysis of SMT PQFP Packages and Interconnections

[+] Author and Article Information
J. H. Lau

Surface Mount Development Center, Hewlett-Packard Company, Palo Alto, CA 94304

J. Electron. Packag 111(1), 2-8 (Mar 01, 1989) (7 pages) doi:10.1115/1.3226505 History: Received October 21, 1988; Online November 09, 2009


An elasto-plastic analysis of the thermal stresses and strains in a surface mounted plastic-quad-flat-pack (PQFP) assembly by using a 3-D finite element method is presented in this paper. Detailed stress and strain distributions and whole-field displacements of the assembly are also provided for a better understanding of its mechanical behavior during thermal cycling. It was found that the stresses and strains in the PQFP solder joint are smaller than those in the plastic-leaded-chip-carrier (PLCC) solder joint. The results presented herein should be useful in the design for reliability of this class of surface mount assemblies.

Copyright © 1989 by ASME
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